Ottawa, Nov. 26, 2025 (GLOBE NEWSWIRE) -- The global semiconductor and IC packaging materials market generated revenue of USD 48.48 billion in 2025, and this figure is projected to grow to USD 114.28 ...

2025年に中国で製造されるICは、中国内で消費されるICの19.4％に留まり、中国が「中国製造2025」で目指す自給率70％に遠く及ばない、との予測を市場調査会社IC Insightsが公表した。 IC Insightsは以前より、中国製造2025が掲げていた国内自給率70％の達成は難しい ...

According to projections from Towards Packaging, the global semiconductor and IC packaging materials market is set to increase from USD 53.48 billion in 2026 to nearly USD 114.28 billion by 2034, ...

PENANG, Malaysia -- Intel aims to quadruple capacity for its most advanced chip packaging services by 2025, including with a new facility in Malaysia, as America's biggest chipmaker seeks to regain ...