Smooth and straight connections must be created at PCB (Printed Circuit Board) layout. BGA pins may need to be re-assigned, if the BGA is re-configurable, but that's necessary to keep signals and ...

Design considerations for moving from 0.5mm pitch to 0.4mm pitch and below. Package-on-package is a method of stacking components atop one another. Some OEMs use PoP to reduce the board real estate ...

During electrical design process, certain design choices need to be made. One example is USB C type connector-based design with a straddle-mount connector. In such scenario, the overall PCB thickness ...

In PCB layout designing, especially for BGA (ball grid array), the PCB fanout, land, and via are particularly important. Fanouts are traces from the device lands to adjacent via, as shown in Fig. 1. A ...

In some designs where electro-magnetic interference (EMI) is a concern, the external layer or top layers aren’t used to route even the outer periphery. In that case the top layer is used for a ground ...

The Ball Grid Array, or BGA package is no longer the exclusive preserve of large, complex chips on computer motherboards: today even simple microcontrollers are available with those little solder ...

The main script(bga_dogbone.py) creates dogbone vias for all pads with connected nodes on a Kicad PCB component(module). The component is assumed to be a normal non ...