Video system design goes beyond evaluating and using the right microprocessors, peripheral chips and other related components. Consider that high-pin count, fine-pitch BGAs ranging upwards of 1,052 ...
The Ball Grid Array, or BGA package is no longer the exclusive preserve of large, complex chips on computer motherboards: today even simple microcontrollers are available with those little solder ...
In PCB layout designing, especially for BGA (ball grid array), the PCB fanout, land, and via are particularly important. Fanouts are traces from the device lands to adjacent via, as shown in Fig. 1. A ...
In some designs where electro-magnetic interference (EMI) is a concern, the external layer or top layers aren’t used to route even the outer periphery. In that case the top layer is used for a ground ...
Design considerations for moving from 0.5mm pitch to 0.4mm pitch and below. Package-on-package is a method of stacking components atop one another. Some OEMs use PoP to reduce the board real estate ...
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