Semiconductor Engineering

Packetized Scan Test

Bus-based packetized scan data decouples test delivery and core-level DFT requirements so core-level compression configuration can be defined completely independently of chip I/O limitations. Grouping ...
Design-Reuse

DeFacTo Unveils New Design for Test Product that Eliminates Need for Gate-level Scan; Creates Industry's First High-level DFT Sign-off Methodology

HiDFT-Scan Analyzes, Implements Scan Test Structures in Register-Transfer Level Designs; Closes Historical Gap between RTL and DFT PALO ALTO, Calif.--October 22, 2007--DeFacTo Technologies today ...
Semiconductor Engineering

Shift Left In DFT Design

The semiconductor industry continues to face numerous challenges as designs approach reticle limits, process nodes evolve and engineering resources become increasingly stretched. It is essential to ...
Electronic Design

What’s Next for Physically Aware DFT?

Why isolated flows negatively impact design schedule and PPA. Benefits of unified DFT, synthesis, and physical design flows. Physical implementation optimization methods for test compression and scan ...
Electronic Design

Design-For-Test Links Design And Manufacturing

Historically, testability is an afterthought in the design process. But heightening complexity of chip designs, and especially SoCs, forces testability (and manufacturability) to take a more central ...