New Electronics

TSMC and Cadence to deliver advanced-node design flows and 3D-IC solutions

Cadence Design Systems is collaborating with TSMC to enhance productivity and optimise product performance for AI-driven advanced-node designs and 3D-ICs. The adoption of AI applications has created ...
Business Wire

TSMC and Cadence Collaborate to Deliver AI-Driven Advanced-Node Design Flows, Silicon-Proven IP and 3D-IC Solutions

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it is collaborating with TSMC to enhance productivity and optimize product performance for AI-driven ...
Design-Reuse

Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC's A16 and N2P Process Technologies

Cadence provides the only complete chiplet design, packaging and system analysis solution for TSMC 3DFabric ®. Cadence is expanding its design IP portfolio to meet the demands of the AI training ...
Yahoo Finance

Cadence and TSMC Strengthen Partnership to Enhance AI & 3D-IC Designs

Cadence Design Systems, Inc. CDNS has announced an expansion of its long-standing collaboration with Taiwan Semiconductor Manufacturing Company (“TSMC”), aimed at accelerating time to silicon for ...
Nasdaq

Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC’s A16 and N2P Process Technologies

Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence (Nasdaq: CDNS) today announced it is ...
Nasdaq

Cadence Collaborates with GlobalFoundries to Advance Silicon Photonics IC Design

Cadence photonics solution optimized for GF Fotonix platform, ushering in a new era of silicon photonics products Comprehensive Cadence photonics solution enables customers to streamline monolithic ...
New Electronics

Cadence open-source PDK and reference design now available for SkyWater's 130nm process

SkyWater Technology has announced that a new SkyWater open-source 130 nm process design kit (PDK) from Cadence Design Systems, will be available in the Cadence VLSI (very large-scale integration) ...
Design-Reuse

Cadence Accelerates SoC, 3D-IC and Chiplet Design for AI Data Centers, Automotive and Connectivity in Collaboration with Samsung Foundry

Expanded collaboration includes new multi-year IP agreement and joint development of advanced AI-driven flows on latest SF2P process node SAN JOSE, Calif.— June 16, 2025 — Cadence (Nasdaq: CDNS) today ...
Morningstar

Cadence and NVIDIA Unveil Accelerated Engineering Solutions Purpose-Built for Agentic AI Chip and System Design

New agentic integrated circuit (IC) and physical AI accelerated solutions enable engineers to solve previously impossible chip, system and AI factory challenges Today, Cadence announced an expansion ...