アメリカの半導体素子標準規格を策定する団体・JEDECが、ノートパソコン用メモリモジュールの新しい規格となるCompression ...

Nvidia has reportedly tapped Micron Technology as the first supplier of its next-generation small outline compression attached memory module (SOCAMM) chips, putting the US-based memory maker ahead of ...

SEOUL, Dec. 18 (Yonhap) -- Samsung Electronics Co. said Thursday it has developed low-power server memory solutions capable ...

Samsung Electronics is emerging as an early front-runner in SOCAMM2, a next-generation memory technology for AI servers, by ...

DRAMのメモリモジュール規格「DIMM」に代わる「CAMM」が採用され始めている。CAMMはDIMMとは何が違うのか。メモリモジュール進化の変遷を踏まえて解説する。 DIMMがまだ新しい技術に取って代わられていないのは、少々驚きだ。DIMMは、コンピュータ会社Wang ...

Samsung Electronics is seeking to regain its leadership in the memory market with its latest low-power server memory module, ...

Micron Technology has started customer sampling of its new 192GB SOCAMM2 (Small Outline Compression Attached Memory Module), a low-power DRAM module designed for AI data centers. Save my User ID and ...

ARLINGTON, Va., October 20, 2025--(BUSINESS WIRE)--JEDEC® Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced it is ...

Samsung Electronics Co. announced on Thursday that it has developed low-power server memory solutions designed to support ...

JEDEC® Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced it is nearing completion of JESD328: LPDDR5/5X Small Outline ...

JEDEC, an organization that formulates semiconductor device standards in the United States, has announced that it will standardize Compression Attached Memory Module (CAMM2), a new standard for memory ...

ARLINGTON, Va., October 14, 2025--(BUSINESS WIRE)--JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, has published the annual ...