アメリカの半導体素子標準規格を策定する団体・JEDECが、ノートパソコン用メモリモジュールの新しい規格となるCompression ...

SK hynixは第4四半期の主な取り組みとして、DRAM市場をリードする先端技術を活用する形で、主力製品に据えているDDR5およびHBM3の売上高が、DDR5が前年同期比で4倍以上、HBM3に至っては同5倍以上の伸びを示したとしている。ただし、市場の回復が遅いNAND市場に ...

Nvidia has reportedly tapped Micron Technology as the first supplier of its next-generation small outline compression attached memory module (SOCAMM) chips, putting the US-based memory maker ahead of ...

DRAMのメモリモジュール規格「DIMM」に代わる「CAMM」が採用され始めている。CAMMはDIMMとは何が違うのか。メモリモジュール進化の変遷を踏まえて解説する。 DIMMがまだ新しい技術に取って代わられていないのは、少々驚きだ。DIMMは、コンピュータ会社Wang ...

SEOUL, Dec. 18 (Yonhap) -- Samsung Electronics Co. said Thursday it has developed low-power server memory solutions capable ...

Samsung Electronics Co. announced on Thursday that it has developed low-power server memory solutions designed to support ...

ARLINGTON, Va., October 20, 2025--(BUSINESS WIRE)--JEDEC® Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced it is ...

Micron Technology has started customer sampling of its new 192GB SOCAMM2 (Small Outline Compression Attached Memory Module), a low-power DRAM module designed for AI data centers. Save my User ID and ...

Samsung Electronics is emerging as an early front-runner in SOCAMM2, a next-generation memory technology for AI servers, by ...

Samsung Electronics is seeking to regain its leadership in the memory market with its latest low-power server memory module, ...

JEDEC, an organization that formulates semiconductor device standards in the United States, has announced that it will standardize Compression Attached Memory Module (CAMM2), a new standard for memory ...

ARLINGTON, Va., October 14, 2025--(BUSINESS WIRE)--JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, has published the annual ...