Abstract: Surface roughness and lapping time are important factors to evaluate the lapping results at micron-scale. These factors can be affected by concentration of lapping slurry. In this paper, the ...
Abstract: This paper report a statistical method of performing wafer lapping experimental using Design Of Experiment (DOE) technique in order to get best lapping time to reduced thickness of GaAs ...
The kind of lapping plate Insaco uses plays a vital role in the lapping process. It significantly affects the output of this abrasive machining technique. A plate should not be too hard as it damages ...
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