LoginForgot password?Send Reset LinkBack to login. 1.19. Overview of Cooling Strategies for High-Power 2.5D/3D Packages - 1 1.20. Overview of Cooling Strategies for High-Power 2.5D/3D Packages - 2 ...

Ottawa, Nov. 04, 2025 (GLOBE NEWSWIRE) -- The global semiconductor packaging market, valued at USD 49.89 billion in 2025, is expected to rise to approximately USD 119.96 billion in 2034, based on a ...

KLA KLAC is benefiting from strong advanced packaging growth as demand for more powerful chips continues to grow. The ...

Semiconductor Packaging Market Expected to Reach $60.44 Billion by 2030 IoT products like sensors, actuators, and microcontrollers drive the largest share of the semiconductor packaging market.” - ...

LG Chem announced on September 29 that it has completed the development of a liquid PID (Photo Imageable Dielectric), a key material for advanced semiconductor packaging, and is set to actively target ...

TAIPEI (Taiwan News) — Grand Process Technology has signed a cooperation agreement with National Taiwan University of Science and Technology to build an advanced semiconductor packaging platform and ...

SEOUL, South Korea, July 15, 2025 /PRNewswire/ -- SK keyfoundry, an 8-inch pure-play foundry in Korea, announced today that it has successfully co-developed core technology and completed reliability ...

TOKYO--(BUSINESS WIRE)--Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) today announced the establishment of "JOINT3," a co-creation evaluation framework formed by a ...

TAIPEI (Taiwan News) — Demand for artificial intelligence chips is accelerating growth across the semiconductor industry, ...

The global semiconductor ecosystem is entering a strong growth phase, with the “Foundry 2.0” market projected to exceed $360 billion in 2026 ...

SKC is investing in the U.S. semiconductor packaging startup ‘Chipletz.’ On the 11th, SKC announced that it will participate in Chipletz’s Series B funding round and secure approximately 12% equity.

The announcement ceremony was attended by representatives from the Ministry of Science and Technology, leaders of Viettel Group, leaders of FPT Corporation, representatives from enterprises, research ...