Semiconductor Engineering

Process Variation Analysis Of Device Performance Using Virtual Fabrication — Methodology Demonstrated On A CMOS 14-nm FinFET Vehicle

A new methodology to assess the impact of fabrication inherent process variability on 14-nm fin field effect transistor (FinFET) device performance. August 18th, 2021 - By: Coventor A new methodology ...
Semiconductor Engineering

Design Flow Challenged By 3D-IC Process, Thermal Variation

3D-ICs are proving a challenge even for designers accustomed to dealing with power and performance tradeoffs, but they are considered an inevitable migration path for leading-edge designs due to the ...
Design And Reuse

How to Close Timing at 7nm: 5 Lessons Every Physical Design Team Should Know Why Timing Closure at 7nm Is Different

As semiconductor designs move to advanced process nodes, timing closure becomes significantly more challenging. At 7nm, traditional optimization techniques often fall short due to increased process ...