Editor's NoteThis series unpacks complex and unfamiliar technologies—ranging from AI and semiconductors to telecommunications ...

TSMC is expecting to start production of 3nm wafers at its second Japanese chip fab in 2028. The timeline was confirmed in a ...

Tower Semiconductorは3月25日、合弁会社として運営している日本のアナログファウンドリであるタワー パートナーズ セミコンダクター(TPSCo)の300mmファブ「魚津工場」について生産能力の増強計画を発表した。

The move not only strengthens Japan’s position in the semiconductor sector, but also shows that chip competition is ...

Taiwan Semiconductor Manufacturing Company (TSMC), the worlds leading contract chipmaker, has confirmed plans to begin equipment installation and mass production of 3-nanometre wafers at its second ...

Planned expansion supports the TPSCo announced transition while strengthening Tower’s differentiated optical and photonics ...

TSM targets gross margin expansion in 2026 despite costly global fab expansion, banking on AI chip demand, scale and utilization to offset rising overseas production expenses.

The demonstration uses a silicon MZM without use of exotic materials targeting next-generation 3.2T optical transceivers ...

TSMC was the largest spender in 2025 with $40.9 billion in capex, 25% of the total. TSMC projects 2026 capex will be between ...