Abstract: The method of how to determine the thickness of Cu layer on wafer in CMP process is a key technology in advanced CMP unit, especially in the stress free polishing (SFP) process. In this new ...
Chemical Mechanical Planarization (CMP) is a critical process in the semiconductor, LED wafer, and hard disk manufacturing industry and is used to achieve the substrate wafer's required planarity.
Abstract: The with-in-wafer uniformity and geometry of the CMP process varies across the life of consumables. The pre layer geometry and thickness significantly affect the post CMP process uniformity ...
Effective fabrication of complex, high performance semiconductor devices is highly dependent on the use of chemical mechanical planarization (CMP). This process is used to planarize the wafer surface ...
The semiconductor industry is constantly marching toward thinner films and complex geometries with smaller dimensions, as well as newer materials. The number of chemical mechanical planarization (CMP) ...
Traditional high downforce (>2.0psi, 14kPa) chemical mechanical planarisation (CMP) processes face challenges when used to polish copper with low-k films in damascene interconnect structures.
Key Laboratory of Nonferrous Metals Chemistry and Resources Utilization of Gansu Province and State Key Laboratory of Applied Organic Chemistry, College of Chemistry and Chemical Engineering, Lanzhou ...
For decades, semiconductor manufacturers have used chemical-mechanical polishing (CMP) as the primary technique for the smoothing and leveling (planarization) of dielectrics and metal layers. CMP ...
A potential method for future cost reductions in SiC processing involves the use of plasma polishing SiC wafers before epi growth as a replacement to the traditional CMP process. The crystal growth of ...
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