Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...

The accelerating rate at which the industry adopts new process nodes is posing critical test challenges. Shrinking geometries combined with increased design complexity with respect to metrics such as ...

高電圧スイッチング・マトリックスにより、ワンパス試験で生産性と効率を向上 オペレーターと機器の安全性を高める設計 ...

TOKYO, Dec. 07, 2023 (GLOBE NEWSWIRE) -- Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) today announced three new additions to its suite of memory test products. The ...