Ottawa, Nov. 26, 2025 (GLOBE NEWSWIRE) -- The global semiconductor and IC packaging materials market generated revenue of USD 48.48 billion in 2025, and this figure is projected to grow to USD 114.28 ...

Ottawa, Nov. 04, 2025 (GLOBE NEWSWIRE) -- The global semiconductor packaging market, valued at USD 49.89 billion in 2025, is expected to rise to approximately USD 119.96 billion in 2034, based on a ...

CPO integrates optical components directly into a package, replacing long copper traces with shorter connections.

In October 2023, 123 years after Toppan Printing was founded in Tokyo in 1900, the group was reorganized into a holding company structure with Toppan Inc. as the core operating company. Based on a ...

Under the ACM Planetary Family, ACM’s products are organized into eight distinct families aligned with core process steps across the semiconductor manufacturing flow, collectively referred to as the ...

SKC is investing in the U.S. semiconductor packaging startup ‘Chipletz.’ On the 11th, SKC announced that it will participate in Chipletz’s Series B funding round and secure approximately 12% equity.

CHICAGO, March 25, 2024 /PRNewswire/ -- The report "Semiconductor & IC Packaging Materials Market by Type (Organic substrate, Bonding wires, Leadframes, Encapsulation resins, Ceramic packages, Die ...

On May 12, LX Semicon, a fabless (design-specialized) semiconductor company, announced that it will collaborate with Hanyang University to develop semiconductor packaging heat dissipation technology ...

South Korea’s SK Hynix has announced a major investment of 19 trillion won, equivalent to about $12.90 billion, to build an advanced semiconductor packaging plant in South Korea as it moves to ...

New report shows 2.5D and 3D packaging market could grow 26% annually, outpacing overall chip industry growth as AI moves from data centers into PCs, smartphones and vehicles TSMC expected to maintain ...

TOKYO--(BUSINESS WIRE)--Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) today announced the establishment of "JOINT3," a co-creation evaluation framework formed by a ...