Do you know where semiconductors are created? Requiring strict controls for airborne contamination, humidity, and temperature, cleanrooms sit within special manufacturing facilities called fabs. | Lam Research Corporation
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We're excited to share a virtual video tour of our new research and development facility, the Lam Research Dr. Richard A. Gottscho Laboratory! The new state-of-the-art cleanrooms, labs and meeting spaces will help enable us to develop new technologies, next-generation solutions and strengthen customer support. | Lam Research Corporation
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In 1987, our Concept One® PECVD system hit the semiconductor scene, igniting our tungsten deposition journey and raising the bar for manufacturing precision. Can you guess what else happened that same year? Toshiba introduced NAND flash memory — the tech behind the storage in countless devices we rely on today. Discover more milestones in our history. https://bit.ly/3IaVwpn | Lam Research Corporation
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In 1987, our Concept One® PECVD system hit the semiconductor sce…
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Molybdenum-based metallization is transforming the semiconductor industry, enabling: ◾Faster manufacturing ◾Improved performance ◾Smaller chips See how Mo’s chemical and economic properties outperform their predecessors via the white paper. https://bit.ly/3Fcmk78 | Lam Research Corporation
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From tools to processes, digital twins operate across multiple levels in semiconductor manufacturing. Discover how we use digital twins to improve tool performance, accelerate time-to-market, and reduce costs via our blog. https://bit.ly/3YqU869 | Lam Research Corporation
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Deposition is essential to the fabrication process and varies depending on the material used and purpose it serves on a chip. While many methods exist, the five most common are: ◾ Chemical vapor deposition (CVD) ◾ Electrochemical deposition (ECD) ◾ Physical vapor deposition (PVD) ◾ Ultraviolet thermal processing (UVTP) ◾ Pulsed laser deposition (PLD) After more than four decades in the market, we remain one of the top suppliers of deposition technology and solutions. Explore our extensive produc
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Our cryogenic dielectric etch technology—Lam Cryo 3.0—delivers enhanced etch rates, vertical high aspect ratio (HAR) profiles, and more. Learn how Lam Cryo 3.0 is optimized to manufacture next-generation 3D NAND devices with 400 layers and beyond from Group VP and GM of Etch Product Group, Harmeet Singh. https://bit.ly/3yCkBVv | Lam Research Corporation
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Lam Research : ships its 10,000th single wafer clean chamber
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As chips continue to shrink in size, the complexity and cost of semico…
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The semiconductor industry is bringing 3D advanced packaging …
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With low resistivity and no barrier layers, molybdenum unlocks the n…
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Imagine a workspace where humans and robots work side by side, sea…
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When developing a new DRAM architecture, manufacturers typica…
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In 2024, we charted the path to 1000-layer NAND with Cryo 3.0™, enabl…
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Our proprietary etch technology suite — Akara® — supports the pr…
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The journey of a microchip starts long before it powers your device…
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What is metallization? 🔍 The deposition of metal film, such as …
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In the fast-paced world of semiconductors, there's always e…
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Scaling DRAM demands more than smaller features; it requires new a…
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With ALTUS® Halo, chipmakers gain a solution designed for the next er…
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Step inside of a wafer to see how our tools tackle bonding, dicing, e…
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3D NAND structures allow flash memory manufacturers to pack m…
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You start with a pattern layout. Run the etch process. The result? You …
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As semiconductor technology continues to advance, precise patt…
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After 20 years of high-volume, tungsten-based atomic layer depo…
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